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Projects: Projects for Investigator
Reference Number InnUK/102016/01
Title Tamessa - Turning up the heat in electronics
Status Completed
Energy Categories Not Energy Related 50%;
Energy Efficiency(Industry) 25%;
Other Cross-Cutting Technologies or Research(Environmental, social and economic impacts) 25%;
Research Types Applied Research and Development 100%
Science and Technology Fields ENGINEERING AND TECHNOLOGY (Electrical and Electronic Engineering) 100%
UKERC Cross Cutting Characterisation Not Cross-cutting 100%
Principal Investigator Project Contact
No email address given
Microsemi Semiconductor Limited
Award Type Collaborative Research & Development
Funding Source Innovate-UK
Start Date 01 January 2015
End Date 31 December 2016
Duration 24 months
Total Grant Value £262,982
Industrial Sectors
Region South West
Programme Competition Call: 1402_CRD_HVM_MESF - Manufacturing Electronic Systems of the Future - CRD. Activity Manufacturing electronic systems of the future (CRD)
 
Investigators Principal Investigator Project Contact , Microsemi Semiconductor Limited (30.775%)
  Other Investigator Project Contact , National Physical Laboratory (NPL) (33.254%)
Project Contact , Gwent Electronic Materials Limited (35.971%)
Web Site
Objectives
Abstract The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.
Publications (none)
Final Report (none)
Added to Database 04/12/15